Dear Dr. OOO ,

Thank you very much for submitting an abstract to the THERMINIC Conference.
Congratulations! Your abstract No. 142 "Mean-time-to-crack Model of Microbump
Interconnect in FCGBA Package under Thermal Cyclic Test" has been accepted for
ORAL presentation at THERMINIC 2013.

As a next step, we kindly ask you to submit a full paper with a maximum length
of six pages. Deadline for the full paper upload is July 31, 2013. A printed
version of the papers will be distributed at the event; an electronic version
will be available through IEEE Explore after the conference.

A Word template the full paper, as well as a copyright form and the
instructions for paper upload will be available for download on our website at
the beginning of next week.

IMPORTANT: Please confirm your participation in the conference by a short
reply to this email. We assume that you are the presenting author. Should that
not be the case, please tell us who will be the presenter.

We thank you for joining THERMINIC 2013 and look forward to receiving your
full paper.

Kind regards,

Bernhard Wunderle
- Program Chair -

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